FCBGA packaging substrate

FCBGA (Flip-Chip Ball Grid Array) packaging substrate is a high-performance interconnect solution that provides electrical and mechanical support for semiconductor chips. By employing a flip-chip design in which the die is directly attached to the substrate, it is possible to achieve high signal integrity, efficient heat dissipation, and miniaturization. FCBGA substrates improve the performance, dependability, and scalability of complex integrated circuits. These substrates are frequently utilized in high-speed computing, telecommunications, and advanced electronics.